B09 模内装饰(IMD)射出成型于模具表面滞热分析与验证

模内装饰(IMD)射出成型于模具表面滞热分析与验证

Study on Simulation and Verification the Heat Hysteresis for the Mold surface with In Mold Decoration

陈夏宗1,2、张仁安1,2、林育增1、董世贤1、王奕超1

Shia-Chung Chen, Jen-An Chang, Yu-Tseng Lin, Shih-Hsein Tarng, Yi-Chao Wang

1中原大学 机械工程研究所

Department of Mechanical Engineering, Chung Yuan Christian University

2中原大学 模具与成型科技研究发展中心

R&D Center for Mold and Molding Technology, Chung Yuan Christian University

中文摘要

随着射出成型技术的进步，许多制程相继被开发及研究， IMD模内装饰射出成型技术更是在3C市场被广泛使用。本研究针对薄膜在模穴中所造成之温度差异作探讨，可了解塑料物性、模具温度变化与熔胶温度变化对滞热效果之影响，并且搭配模流分析软件(Moldex3D)来做进一步验证比对，确认薄膜滞热理论分析与实际的效益；实验中采用厚度0.175mm PC薄膜贴附在外观面与无贴附薄膜的传统制程进行比较，利用模内温度传感器记录两侧温度历程，设计不同成型参数与两种成型材料PC、PP来达到研究的完整性。

由研究结果显示，使用PC时模具温度75℃、熔胶温度310℃有最高薄膜滞热温度达到17.7℃；使用PP时，在模具温度25℃熔胶温度280℃有最高薄膜滞热温度效果达14.9℃。当模具温度越低、熔胶温度越高时具有最大滞热效益，反之当模具温度越高、熔胶温度越低则滞热效益最小，并与模拟分析作比较得知其趋势与量值皆有近似的结果。

英文摘要

In-mold decoration (IMD) becomes a more and more popular process recently due to its high manufacturing efficiency; therefore, it is important to investigate and realize the complicated process mechanism of IMD. In this study, a PC film is attached to the cavity side for observing the heat hesitation effect. This effect will be compared with that in conventional injection molding (without PC film) both experimentally and numerically. The results show that PC resin has the highest stagnation temperature (17.7℃) when the melt temperature and mold temperature are 310℃ and 75℃ respectively. PP resin has the highest stagnation temperature (14.9℃) when the melt temperature and mold temperature are 280℃ and 25℃ respectively. Through the comparison between all experimental and simulation results, we can find both experiments and simulation are in a good agreement.

关键词：模内装饰射出成型，PC薄膜，模具表面滞热