Solver Improvements
The following solver improvements have been incorporated into the MPI 5.0
release:
[$#8226] New Fast Fill analysis for Midplane and Fusion models, for quick model and
fill pattern checking.
[$#8226] New Core shift simulation for Midplane, Fusion or 3D flow analysis (requires
MPI/Warp license).
[$#8226] New Dynamic paddle shift analysis for Microchip Encapsulation.
[$#8226] Analysis speed improvements for Midplane/Fusion Fill, Pack and Fiber
analyses.
More robust runner balancing prediction. When convergence problems arise,
the solver attempts to adjust switch-over and packing pressure settings to
obtain better balance results, and always returns the best balance result, not the
result of the last iteration.
[$#8226] Improved warpage prediction through improvements to CRIMS model and
data/prediction correlation process.
[$#8226] New valve gate control options to open/close gates based on pressure,
%volume and ram position, in addition to time and flow front activation. (MVote)
[$#8226] New Heat loss into mold property for hot runners/gates/sprues.
[$#8226] New Consider corner effects solver parameters for Midplane and Fusion
warpage analyses.
[$#8226] New Viscosity treatment at high shear rates solver parameter for improved
viscosity calculation for shear-sensitive materials.
[$#8226] New Number of time steps for 3D cooling flux calculation solver parameter for
the 3D cooling analysis.
[$#8226] New %Air mass solver parameter for the curing phase of the 3D Reactive
Molding process.
[$#8226] Local mold surface temperatures can now be specified for Reaction Injection
Molding and Microchip Encapsulation processes. |