概述
CAE 模流分析技术在笔记本电脑外壳件浇口设计之探讨The Investigation of CAE Mold Flow Analysis in the Design of Notebook PC Cover Gate 李华 Rita Li 科盛科技股份有限公司 CoreTech System Co.,Ltd. 摘 要 创新与快速生产,是现今全球化电子产品市场上不变的法则。射出成型技术可以提供快速便捷的技术。 对射出成型的塑料产品而言,其模具的优劣,关键地决定整个产品开发过程之效率。透过 Moldex3D 模流分 析的的应用,本研究探讨不同浇口设计对笔记本计算机外壳件成型的影响,进而找出最佳的成型参数。 关键词:电子产品、模流分析、浇口设计。 Abstract Innovation with speedy manufacture is of invariance in nowadays global marketplace of electronic products. The injection molding technique is rapid of yield equipment with convention. For injection molding products of polymer materials, quality of the mold crucially determines efficiency of a whole product develOPMent process. Through the Moldex3D mold-flow software, this paper reports how the cover of notebook PC is influenced by different gate-designs. The ultimate goal, is to optimize the parameters of the molding design, according to from simulation results. Keyword: Electronics products, mold-flow analysis, gate design. |
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