B08-应用模流分析与场协同理论探讨小尺寸 IC 封装之充填平衡

应用模流分析与场协同理论探讨小尺寸 IC 封装之充填平衡

THE INVESTIGATION OF FLOW BALANCE IN SMALL SIZE IC PACKAGING BY SIMULATION ANALYSIS AND FIELD SYNERGY PRINCIPLE

1 张旭铭、2 杨耀升、3  郑志清、4 陈宏宾、5 萧乃仁

1Shiuh-Ming Chang, 2 Yao-Sheng Yang, 3Hung-Pin Chen, 4Chi-Ching Cheng , 5Nai-Jen Hsiao

1 高苑科技大学机械与自动化系助理教授

1Dept. Mechanical and Automation Engineering, Kao Yuan University

2 高苑科技大学电子系助理教授

2Department and Graduate School of Electronic Engineering, Kao Yuan University

3 高苑科技大学电子系研究生

3Department and Graduate School of Electronic Engineering, Kao Yuan University

4 高苑科技大学机械与自动化系研究生

4Dept. Mechanical and Automation Engineering, Kao Yuan University, Kao Yuan University

5 科盛科技股份有限公司

5CoreTech System (Moldex3D) Co., Ltd

应用 CAE 技术于小尺寸 IC 封装模拟已发展多年，然而如何在几何限制下，有效预测封装时的融 胶流动行为仍为业界一大挑战。本研究利用模流分析软件 Moldex3D R9.1 搭配场协同理论，进行小尺 寸 IC 封装制程之流动评估，探讨在不同浇口数的几何变化下，融胶充填流动变化对产品的整体影响， 并从结果分析图获取最佳的几何参数。

关键词: 小尺寸 IC 封装、场协同理论、流动性平衡。

Applying CAE in simulation analysis of small size IC packaging has been developed for years. However, to predict the flow behavior of IC packages is still a huge challenge due to its geometric limitations. In this paper, the field synergy principle is implemented for the investigation of the flow balance in different geometries with various gate designs by using a CAE simulation software, Moldex3D R9.1. Furthermore, an optimized geometric design can be gained through the assistance of simulation and its results.

Keyword: Small size IC packaging, Field synergy principle, flow balance.