B08-应用模流分析与场协同理论探讨小尺寸 IC 封装之充填平衡

5. Runner Design

First, we used material PLASKON_SMT-B-1LV (epoxy resin) shown in Table 1, the dimension size of IC product is: 122mmx45mmx3mm, width is 0.4 mm. There are three types of filling; one foot injection, two feet injection and three feet injection. Filling conditions : filling time: 6sec, melt temperature: 80℃, mold temperature: 80℃ and packing time: 5sec.

6. Results and Discussion

Figures 1-3 show the IC design for one foot, two feet and three feet. Because, in this study, we want to compare the filling balance by field synergy principle. Figure 4 shows average field synergy angle in section I, the angle is 113.575 for one foot. Figure 5 shows average field synergy angle in section I, the angle is 107.144 for two feet. Figure 6 shows average field synergy angle in section I, the angle is 95.24 for three feet. We can find the lowest average field synergy angle in section I is three feet of filling gates and with better balance of filling. It is concluded that three feet filling of IC package molding is a better design in this study. Figure 7 shows average field synergy angle in section II, the angle is 104.225 for three feet. Average field synergy angle in section II is larger than the angle in section I, because the temperature of melt front

becomes cooler and is not as hot as the beginning of filling. Figure 8 shows IC molding product of three feet. It is clear that molding is smooth and without inner wire sweep happening.