B08-应用模流分析与场协同理论探讨小尺寸 IC 封装之充填平衡

7.References

[1] Shiuh Ming Chang,Hung Pin Chen,"Indoor Thermal Comfort Optimization by Field Synergy Principle for Air-Conditioning", International Journal of Intelligent Systems and Applications (IJISA),Volume 3, Number 1( publishing)

[2] Shiuh Ming Chang*、Jie Hao Chang、Jiun Hau Huang, “Optimization Cooling Fan Position for CPU by Field Synergy Principle”,Journal of Professional Mechanical Engineers, 2010, Vol.3, No.3, pp.1-7,

[3] Shiuh Ming Chang*、Jia Fu Lee、Chih Hua Hsu、Cai Wan Chang－Jian,” Auto Mode IC Mold Flow by Uniform Filling Principle“,Journal of Professional Mechanical Engineers, 2010, Vol.3, No.3, pp.14-18

[4] Shiuh-Ming Chang*, Cai-Wan Chang-Jian ,” Influence on Pem Fuel Cell Bipolar Plate by Different Fiber Orientation and Cooling System”, 2010 International Symposium on Computer, Communication, Control and Automation, IEEE 2010, 3CA,2010, May 5-7, 2010, Taiwan, Tainan ,Vol II, , pp5-8(EI)

[5] Shiuh-Ming Chang*, Jenn-Kun Kuo ,” Field Synergy Principle to Square and Trapezoid Types Fuel Cell Bipolar Plate of Mold Injection”, 2010 Asia-Pacific Power and Energy Engineering Conference (APPEEC 2010), IEEE 2010, March 27-31, China, Crowne Plaza Chengdu, Paper ID:91254, 03-083, pp1-6 (EI)

[6] L. T. Nguyen, A. Danker, N. Santhiran, and C. R. Shervin, “Flow Modeling of Wire Sweep During Molding of Integrated Circuits”, ASME Winter Annual Meeting, 1992.

[7] A. A. O. Tay, K. S. Yeo, J. H. Wu and T. B. Lim, “The Effect of Wire-bond Geometry and Die Setting on Wire Sweep”, IEEE Transactions on components, packaging, and manufacturing technology ─ part B,Vol. 18, NO.1, February 1995

[8] A. A. O. Tay, K. S. Yeo, J. H. Wu and T. B. Lim, “Wirebond Deformation During Molding of IC Packages”, Transactions of ASME, Vol.177, pp.178-184, 1995.

[9] S. Han and K. K. Wang, “Analysis of Wire Sweep Related to Encapsulation of Semiconductor Chips”, SPE ANTEC Technical Papers, 39, 153-157 , 1993.

[10] S. Han and K. K. Wang, “Reduction of Wire Sweep During Chip Encapsulation by Runner Balancing and Ram Control ”, presented at the 1994 International Mechanical Engineering Congress and Exposition, Chicago, IL, November 6-11, appeared in Advances in Computer-Aided Engineering (CAE) of Polymer Processing, MD-Vol. 49/HTD-Vol. 283, ASME, pp175-190, November 1994.